Low dielectric loss thermoset resin system at high frequency for use in electrical components
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United States of America Patent
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Feb 28, 2017
Grant Date -
Dec 20, 2012
app pub date -
Mar 2, 2011
filing date -
Mar 5, 2010
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Abstract
The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.
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