Method of fabricating electromagnetic bandgap (EBG) structures for microwave/millimeterwave applications using laser processing of unfired low temperature co-fired ceramic (LTCC) tape

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United States of America Patent

PATENT NO 9579748
SERIAL NO

14295647

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Abstract

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Substrates and methods to fabricate and use millimeter wave Sievenpiper EBG structures such that the conductive portions are internal to an LTCC package.

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Patent Owner(s)

  • E. I. DU PONT DE NEMOURS AND COMPANY;WEMTEC, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hughes, Elizabeth D Raleigh, US 4 57
Mckinzie,, III William E Fulton, US 38 1797
Nair, Deepukumar M Cary, US 19 170
Parisi, James M Stem, US 5 103
Smith, Michael Arnett Wake Forest, US 5 58

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