Sensor mounting in an implantable blood pump
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United States of America Patent
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Feb 28, 2017
Issued Date -
N/A
app pub date -
Aug 30, 2013
filing date -
Aug 31, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- F04D:NON-POSITIVE-DISPLACEMENT PUMPS
- G01B:MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIME....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
- A61M:DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE B....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
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