Backplane module and method of manufacturing same
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United States of America Patent
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Feb 21, 2017
Grant Date -
Sep 24, 2015
app pub date -
Jan 30, 2015
filing date -
Mar 18, 2014
priority date (Note) -
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Abstract
A method of manufacturing a backplane module includes providing a thermally conductive substrate, and applying a predetermined volume of epoxy extending between a first electrical component disposed on the thermally conductive substrate and a second electrical component disposed on the thermally conductive substrate to create an electrical pathway therebetween.
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