Multi-strike process for bonding

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United States of America Patent

PATENT NO 9576929
SERIAL NO

14997727

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Abstract

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A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsiao-Yun Hsin-Chu, TW 20 153
Shao, Tung-Liang Hsin-Chu, TW 97 792
Shih, Wen-Lin Hsin-Chu, TW 8 21
Tung, Chih-Hang Hsin-Chu, TW 103 1503
Yu, Chen-Hua Hsin-Chu, TW 2207 47923

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