Three-dimensional electronic packages utilizing unpatterned adhesive layer
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United States of America Patent
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Feb 21, 2017
Grant Date -
Jul 2, 2015
app pub date -
Jun 25, 2013
filing date -
Jun 25, 2012
priority date (Note) -
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Abstract
An electronic package may be fabricated by forming a first layer of insulating material on a first substrate such that the first layer covers a contact pad; forming an opening through the first layer to expose the contact pad; forming an un-patterned second layer on the first layer, the second layer including an adhesive having a viscosity less than that of the first layer, wherein a region of the second layer obstructs the contact pad; removing the region to re-expose the contact pad; aligning a second substrate with the first substrate such that a via of the second substrate is aligned with the opening; bonding the first substrate and the second substrate together at the second layer; and forming an interconnect in contact with the contact pad by depositing a conductive material through the via and the opening.
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