Semiconductor device comprising an output driver circuitry, a packaged semiconductor device and associated methods
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United States of America Patent
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Feb 21, 2017
Grant Date -
Jan 1, 2015
app pub date -
Feb 24, 2012
filing date -
Feb 24, 2012
priority date (Note) -
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Abstract
A semiconductor device comprises a plurality of output pads bondable to an output pin, a plurality of reference pads bondable to a reference pin, and output driver circuitry with a control terminal for receiving a control signal and arranged to drive the plurality of output pads relative to the plurality of reference pads in dependence on the control signal. The output driver circuitry includes driver sections and selection circuitry. Each driver section is arranged to drive an output pad relative to the single reference pad in dependence on a respective section control signal. The reference pads are connected in a one-to-one relationship to the driver sections. The output pads are connected in a one-to-one relationship to the driver sections. The selection circuitry provides the respective section control signals to the driver sections in dependence on at least one selection signal and the control signal.
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