Solder application method and apparatus
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United States of America Patent
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Feb 21, 2017
Grant Date -
Feb 11, 2016
app pub date -
Aug 8, 2014
filing date -
Aug 8, 2014
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Abstract
A method of applying solder includes providing a first roller and a second roller, where at least one of the first and second rollers has an outer surface comprising a solder wicking material. A metallic article is provided, the metallic article having a first side and a second side, and having an opening extending from the first side to the second side. The metallic article is dipped in solder, where the dipping forms an initial coating of solder on the metallic article. After the dipping, the metallic article is fed between the first and second rollers. The wicking material removes solder from the metallic article, such that a solder thickness of the initial coating on the metallic article is reduced after exiting the first and second rollers.
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