Electronic component mounting system, electronic component mounting method, and electronic component mounting machine
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United States of America Patent
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Feb 14, 2017
Grant Date -
Mar 17, 2016
app pub date -
Nov 25, 2015
filing date -
Dec 20, 2013
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Abstract
In an electronic component mounting method, a light-emitting element is temporarily fixed to a board by solder paste and adhesive, the adhesive is cured to fix a main body of the light-emitting element to the board, and solder is melted to bond a terminal of the light-emitting element to the board. The method includes: detecting a positional deviation of an emission portion in a top surface of the light-emitting element; detecting a position of the light-emitting element in a state in which the light-emitting element is held by an absorption nozzle; positioning the emission portion to a prescribed position on the board based on the positional deviation and the position of the light-emitting element; mounting the light-emitting element on the board at a position deviated from the prescribed position by the positional deviation; curing the adhesive; and heating the board to melt the solder.
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