Memory card systems comprising flexible integrated circuit element packages, and methods for manufacturing said memory card systems
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 14, 2017
Grant Date -
Nov 5, 2015
app pub date -
Mar 18, 2013
filing date -
Dec 12, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A memory card system may include a flexible integrated circuit device package, an upper flexible case, a lower flexible case, a wiring structure, an anisotropic conductive film, etc. The flexible integrated circuit device package may include a material capable of being bent or folded and a flexible integrated circuit device having a connection pad for an electrical connection. The upper flexible case may include a material capable of being bent or folded and may cover the integrated circuit device package. The lower flexible case may include a material capable of being bent or folded and the flexible integrated circuit device package may be fixed to the lower flexible case. The wiring structure may include a material capable of being bent or folded, and also may include a connection wiring disposed on an inner surface of the upper flexible case for electrically connecting the flexible integrated circuit device package with an external device, a connection pin disposed on an outer surface of the upper flexible case, and a via wiring passing through the upper flexible case. The anisotropic conductive film may be disposed between the flexible integrated circuit device package and the upper flexible case for electrically connecting the connection pad with the connection wiring.
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