RADIO FREQUENCY MICRO-ELECTROMECHANICAL SYSTEMS HAVING INVERTED MICROSTRIP TRANSMISSION LINES AND METHOD OF MAKING THE SAME
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United States of America Patent
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app pub date -
Aug 28, 2015
filing date -
Aug 28, 2015
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Abstract
A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
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