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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SUMITOMO ELECTRIC INDUSTRIES LTD	5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 541-0041

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Ota, Hajime	Osaka, JP	55	188
# of filed Patents : 55 Total Citations : 188

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• 8 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Aug 14, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
February 14, 2017	US,9570215,B2   US9570215B2	GRANTED PATENT AS SECOND PUBLICATION
November 20, 2014	US,20140342917,A1   US20140342917A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9570215

Method for manufacturing precursor, method for manufacturing superconducting wire, precursor, and superconducting wire

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Abstract

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A method for manufacturing a superconducting wire includes the following steps. A laminate metal having a first metal layer and a Ni layer formed on the first metal layer is prepared. An intermediate layer (20) is formed on the Ni layer of the laminate metal. A superconducting layer (30) is formed on the intermediate layer (20). By subjecting the laminate metal to a heat treatment after at least either of the step of forming a intermediate layer (20) and the step of forming a superconducting layer (30), a nonmagnetic Ni alloy layer (12) is formed from the laminate metal.

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Description

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Claims

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Claims data not available

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Legal Events

 

• MAFP2024
• MAFP2020
• AS2019
• I2017
• STCF2017
• P2014
• F2014
• PD2008

Date	Code	Event	Description
Jul 31, 2024	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8
Jul 30, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Mar 18, 2019	AS	ASSIGNMENT	free format text: CHANGE OF ADDRESS;ASSIGNOR:TOYO KOHAN CO., LTD.;REEL/FRAME:066208/0827 Owner name: TOYO KOHAN CO., LTD., JAPAN Effective Date: Mar 18, 2019
Feb 14, 2017	I	Issuance
Jan 25, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Nov 20, 2014	P	Published
Aug 05, 2014	F	Filing
Nov 28, 2008	PD	Priority Date