Composite activation indicia substrate
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United States of America Patent
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Feb 14, 2017
Issued Date -
N/A
app pub date -
Sep 17, 2012
filing date -
Sep 17, 2012
priority date (Note) -
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Abstract
The present invention is generally directed towards a card and package assembly and methods of making the same. Card and package assemblies in accordance with some embodiments of the present invention may include a package, a data card, the data card packaged at least in part within the package, and an activation indicia, the activation indicia comprising a first portion printed on the package and a second portion printed on the data card. Methods of packaging a data card in accordance with some embodiments of the present invention may include steps of manufacturing or otherwise obtaining a data card, manufacturing or otherwise obtaining a package, determining an activation indicia, packaging the data card at least in part within the package, and printing the activation indicia in part on the data card and in part on the package.
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