Polishing slurry and substrate polishing method using the same
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United States of America Patent
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Feb 14, 2017
Grant Date -
Jul 2, 2015
app pub date -
Oct 20, 2014
filing date -
Dec 27, 2013
priority date (Note) -
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Abstract
A polishing slurry for tungsten and a substrate polishing method are disclosed. The polishing slurry includes an abrasive for performing polishing and having positive zeta potential, and a potential modulator for promoting the oxidation of the tungsten and for controlling the zeta potential of the abrasive.
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International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C03C:CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREO....
- C09G:POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; S....
- C23F:NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM S....
- B44C:PRODUCING DECORATIVE EFFECTS
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