Silicon sputtering target with special surface treatment and good particle performance and methods of making the same
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United States of America Patent
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Feb 14, 2017
Grant Date -
Oct 23, 2014
app pub date -
Nov 7, 2012
filing date -
Nov 8, 2011
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Abstract
A sputter target assembly comprising a Si target and a backing plate is provided wherein the backing plate is bonded to the target. The Si target comprises a smooth, mirror-like surface and has a surface roughness of less than about 15.0 Angstroms. Methods are provided for producing silicon target/backing plate assemblies wherein a silicon blank is processed to remove scratches from the blank surface resulting in a mirror like surface on the target, and a surface roughness of 15.0 Angstroms or less. The method comprises a first and second cleaning step with the first step being performed before the scratch removal step, and the second step being performed after the scratch removal.
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