Method for treating substrate that support catalyst particles for plating processing
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United States of America Patent
Stats
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Feb 7, 2017
Grant Date -
Aug 20, 2015
app pub date -
Sep 27, 2013
filing date -
Sep 28, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased.
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International Classification(s)
- 2013 Application Filing Year
- B05D Class
- 1279 Applications Filed
- 1019 Patents Issued To-Date
- 79.68 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B05D Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Aug 7, 2028 |
