Nano-copper solder for filling thermal vias
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United States of America Patent
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Feb 7, 2017
Grant Date -
Apr 30, 2015
app pub date -
Oct 27, 2014
filing date -
Oct 28, 2013
priority date (Note) -
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Abstract
A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can be nanocopper, which can be either push/pull into the holes on the electronic board or a combination of push and pull. The push/pull can be performed by using a mechanical device or by a person. A capping layer can be on both side of the via. The vias formed by using the nanomaterials provides a high efficient vertical heat transferring path from one side of the electronic board to the other side of the electronic board.
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