Lightweight cavity filter structure

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United States of America Patent

PATENT NO 9564672
APP PUB NO 20120242425A1
SERIAL NO

13426257

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Abstract

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Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.

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Patent Owner(s)

Patent OwnerAddress
INTEL CORPORATION2200 MISSION COLLEGE BOULEVARD SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Burke, Ian Lake Forest, US 10 21
Cook, Jason Huntington Beach, US 35 397
Khanifar, Ahmad Laguna Hills, US 24 493

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