Semiconductor package and method of manufacturing the same
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United States of America Patent
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Feb 7, 2017
Grant Date -
Dec 4, 2014
app pub date -
Dec 28, 2012
filing date -
Dec 29, 2011
priority date (Note) -
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Abstract
Disclosed herein is a semiconductor package having a fan-out structure in which a semiconductor chip is buried by an encapsulation member and an external connection member is disposed below the buried semiconductor chip. The semiconductor package includes an embedded rewiring pattern layer, an upper semiconductor chip disposed above the embedded rewiring pattern layer, an upper encapsulation member encapsulating the upper semiconductor chip, a lower semiconductor chip disposed below the embedded rewiring pattern layer, and a lower encapsulation member encapsulating the lower semiconductor chip to prevent exposure thereof.
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