Electrodeposited copper foil

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United States of America Patent

PATENT NO 9562298
APP PUB NO 20150267313A1
SERIAL NO

14486107

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Abstract

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An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

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Patent Owner(s)

Patent OwnerAddress
CHANG CHUN PETROCHEMICAL CO LTD7F NO 301 SONGJIANG RD ZHONGSHAN DIST TAIPEI CITY 104

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Kuei-Sen Taipei, TW 26 88
Chou, Jui-Chang Taipei, TW 42 76
Lai, Yao-Sheng Taipei, TW 43 65
Liu, Yueh-Min Taipei, TW 4 7
Lo, Hsi-Hsing Taipei, TW 4 9

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