Method and apparatus for sky-line potting
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United States of America Patent
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Feb 7, 2017
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N/A
app pub date -
Feb 28, 2012
filing date -
Feb 28, 2012
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Abstract
The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.
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