Package for optical module
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United States of America Patent
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Jan 31, 2017
Grant Date -
Nov 19, 2015
app pub date -
Jul 1, 2013
filing date -
Jul 3, 2012
priority date (Note) -
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Abstract
A package for optical module includes a flat-plate-shaped metal base, and a ceramic circuit board in which a plurality of terminals are arranged in a longitudinal direction, and which is joined to an upper surface of the metal base by soldering. The ceramic circuit board has a shape change portion in which the ceramic circuit board is changed in shape along the longitudinal direction, and a region of the ceramic circuit board not including the shape change portion is joined to the metal base by soldering. The shape change portion of the ceramic circuit board is a portion where a width is changed along the longitudinal direction, or a portion where a thickness is changed along the longitudinal direction.
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