Stress relief for rigid components on flexible circuits
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United States of America Patent
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Jan 31, 2017
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N/A
app pub date -
Jan 23, 2015
filing date -
Jan 24, 2014
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Abstract
In order to limit the stress and strain applied to a printed circuit board while still maintaining flexibility, multiple small rigid mesas are formed on a flexible printed circuit, where the rigid mesas are physically isolated by trenches formed around their perimeters. Individual electronic components are attached to the multiple rigid mesas. These trenches form openings at which the printed circuit board is enabled to flex, bend or twist, thereby minimizing, if not eliminating, resulting stress applied to the interconnection between the electronic components and the rigid mesas.
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