Integrated circuit device packages and methods for manufacturing integrated circuit device packages
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United States of America Patent
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Jan 31, 2017
Grant Date -
Mar 19, 2015
app pub date -
Mar 18, 2013
filing date -
Apr 26, 2012
priority date (Note) -
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Abstract
An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.
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