Extreme ultraviolet lithography mask and multilayer deposition method for fabricating same

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United States of America Patent

PATENT NO 9557636
APP PUB NO 20140377693A1
SERIAL NO

14479411

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Abstract

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A mask, method of fabricating same, and method of using same are disclosed. In an example, a mask includes a substrate and a reflective multilayer coating deposited over the substrate. The reflective multilayer coating is formed by positioning the substrate such that an angle α is formed between a normal line of the substrate and particles landing on the substrate and rotating the substrate about an axis that is parallel with a landing direction of the particles. In an example, reflective multilayer coating includes a first layer and a second layer deposited over the first layer. A phase defect region of the reflective multilayer coating includes a first deformation in the first layer at a first location, and a second deformation in the second layer at a second location, the second location laterally displaced from the first location.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDNO 8 LI-HSIN RD 6 SCIENCE-BASED INDUSTRIAL PARK HSIN-CHU 300-77 R O C

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Yen-Cheng Taipei, TW 85 1437
Yen, Anthony Hsinshu, TW 157 3414
Yu, Shinn-Sheng Hsinchu, TW 132 3917

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