Plating stack to condition a bonding surface

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United States of America Patent

PATENT NO 9556511
APP PUB NO 20140262768A1
SERIAL NO

14205413

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Importance

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Abstract

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A rotary sputtering target assembly and method of making the same including a target and a backing tube having a plated bonding surface. The backing tube and the target are bonded together along the plated bonding surface.

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Patent Owner(s)

Patent OwnerAddress
MATERION CORPORATION6070 PARKLAND BOULEVARD MAYFIELD HEIGHTS OH 44124

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guenley, William Albuquerque, US 3 0

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