Polyimide precursor, polyimide, polyimide film, polyimide metal laminate, and polyimide solution

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United States of America Patent

PATENT NO 9556312
APP PUB NO 20150132591A1
SERIAL NO

14401058

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Abstract

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A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.

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Patent Owner(s)

Patent OwnerAddress
UBE CORPORATION1978-96 OAZA KOGUSHI UBE-SHI YAMAGUCHI-KEN 7558633

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hisano, Nobuharu Ube, JP 29 174
Kohama, Shin-ichiro Ube, JP 6 17
Oishi, Yoshiyuki Morioka, JP 16 32

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