Heat dissipation system

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United States of America Patent

PATENT NO 9554486
APP PUB NO 20140238647A1
SERIAL NO

14185664

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Abstract

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An electronic component includes a component enclosure. At least one subcomponent is positioned within the component enclosure. The at least one subcomponent is configured to be thermally coupled to the component enclosure.

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Patent Owner(s)

Patent OwnerAddress
DEUTSCHE BANK AG NEW YORK BRANCH AS COLLATERAL AGENT60 WALL STREET NEW YORK NY 10005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pikovsky, Anatoly Sharon, US 10 49

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