High-power pulsed magnetron sputtering process as well as a high-power electrical energy source
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United States of America Patent
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Jan 24, 2017
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Sep 23, 2010
app pub date -
Jul 28, 2009
filing date -
Jul 29, 2008
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Abstract
A high-power pulsed magnetron sputtering process, wherein within a process chamber by means of an electrical energy source a sequence of complex discharge pulses is produced by applying an electrical voltage between an anode and a cathode in order to ionize a sputtering gas. The complex discharge pulse is applied for a complex pulse time. The cathode has a target comprising a material to be sputtered for the coating of a substrate, and the complex discharge pulse includes an electrical high-power sputtering pulse having a negative polarity with respect to the anode and being applied for a first pulse-time, the high-power sputtering pulse being followed by an electrical low-power charge cleaning pulse having a positive polarity with respect to the anode and being applied for a second pulse-time. The ratio τ1/τ2 of the first pulse-time (τ1) in proportion to the second pulse-time (τ2) is 0.5 at the most.
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