Al-based alloy sputtering target and Cu-based alloy sputtering target
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 24, 2017
Grant Date -
Nov 21, 2013
app pub date -
Dec 20, 2011
filing date -
Feb 4, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Film-formation rate can be increased in the pre-sputtering and in the subsequent sputtering onto a substrate or the like, and sputtering failures such as splashes can be inhibited, by making an Al-based alloy or Cu-based alloy spurting target fulfill the following requirements (1) and/or (2) when the total area ratio of crystal orientations <001>±15°, <011>±15°, <111>±15°, <112>±15°, and <012>±15° in the sputtering surface normal direction in the depth within 1 mm from the uppermost surface of the sputtering target is referred to as a P value: (1) the area ratio PA of <011>±15° to the P value: 40% or lower; and (2) the total area ratio PB of <001>±15° and <111>±15° to the P value: 20% or higher.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2011 Application Filing Year
- C23C Class
- 1852 Applications Filed
- 1328 Patents Issued To-Date
- 71.71 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C23C Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 24, 2028 |
