Package structure and method for manufacturing same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9548427
APP PUB NO 20160351753A1
SERIAL NO

14864585

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to a method for manufacturing a LED package structure. First, a support plate including a top surface is provided. An annular groove is defined on the top surface and a protruding portion on the support plate is surrounded by the annular groove. Second, a reflecting layer is formed on surfaces and periphery portions of the annular groove. Then, a wiring pattern is formed on the top surface corresponding to the protruding portion. An insulting layer is formed in spaces of the wiring pattern and the annular groove. The support plate is removed and a receiving groove is formed by the insulting layer and the corresponding protruding portion. Finally, a LED chip is received in the receiving groove and bonded on the wiring pattern to obtain a LED package structure. A LED package structure made by the above method is also provided.

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Patent Owner(s)

Patent OwnerAddress
ZHEN DING TECHNOLOGY CO LTDNO 6 LANE 28 SAN HO RD SAN SHI VILLAGE TAYUAN TAOYUAN
LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO LTDNO 18-2 TENGFEI ROAD ECONOMY AND TECHNOLOGY DEVELOPMENT ZONE QINHUANGDAO CITY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Yu-Cheng New Taipei, TW 74 315

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 17, 2028
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