Light emitting diode chip having multi microstructure substrate surface

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United States of America Patent

PATENT NO 9548419
SERIAL NO

14521471

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Abstract

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A light emitting diode chip including a substrate and a light emitting diode element layer is provided. The substrate has a growth surface and a plurality of microstructures on the growth surface, wherein an area of the growth surface occupied by the microstructures is A1 and an area of the growth surface not occupied by the micro-structures is A2, wherein A1 and A2 satisfies the relation of 0.1≦A2/(A1+A2)≦0.5. The light emitting diode element layer is disposed on the growth surface of the substrate.

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Patent Owner(s)

  • EVERLIGHT ELECTRONICS CO., LTD.;SOUTHERN TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Ming-Lun Tainan, TW 12 78

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