Method for forming film layer and substrate including the film layer
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United States of America Patent
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Jan 17, 2017
Grant Date -
Aug 27, 2015
app pub date -
Dec 16, 2013
filing date -
Aug 6, 2013
priority date (Note) -
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Abstract
A method of forming a film layer and a substrate comprising the film layer to reduce occurrence of defects and improve the quality of the film layer are described. The method of forming a film layer comprises forming a plurality of sub-film layers of a same material overlapped with each other on a substrate by multiple steps to constitute the film layer, wherein each time a sub-film layer is formed, the newly-formed sub-film layer is cleaned immediately. The substrate comprises a film layer formed by the above method.
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