Hermetically sealed electronic device using solder bonding

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United States of America Patent

PATENT NO 9545682
APP PUB NO 20160059339A1
SERIAL NO

14931957

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Abstract

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Solder can be used to wet and bind glass substrates together to ensure a hermetic seal that superior (less penetrable) than conventional polymeric (thermoplastic or thermoplastic elastomer) seals in electric and electronic applications.

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Patent Owner(s)

  • FERRO CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blonski, Robert P North Royalton, US 17 342
Khadilkar, Chandrashekhar S Broadview Heights, US 23 308
Maloney, John J Solon, US 28 238
Sridharan, Srinivasan Strongsville, US 135 3479

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