System-level packaging methods and structures

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United States of America Patent

PATENT NO 9543269
APP PUB NO 20130320534A1
SERIAL NO

13984929

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Abstract

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A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface of the packaging substrate, wherein each package layer is formed by subsequently forming a mounting layer, a sealant layer, and a wiring layer. Further, the method includes forming a top sealant layer and planting connection balls on the second functional surface of the packaging substrate.

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Patent Owner(s)

Patent OwnerAddress
TONGFU MICROELECTRONICS CO LTDJIANGSU PROVINCE NANTONG CITY CHONGCHUAN ROAD 226006 NO 288 NANTONG CITY JIANGSU PROVINCE 226006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shi, Lei Nantong, CN 557 2723
Tao, Yujuan Nantong, CN 20 85
Wang, Honghui Nantong, CN 23 128

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