Semiconductor package structure

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United States of America Patent

PATENT NO 9543237
APP PUB NO 20160181185A1
SERIAL NO

14747641

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Abstract

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A semiconductor package structure includes a lead frame, a chip and a molding compound. The lead frame includes a tray pad and a plurality of leads. Two of the leads are different in height positions. The chip is disposed on the tray. The molding compound encapsulates the chip and a portion of each lead.

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Patent Owner(s)

Patent OwnerAddress
ALI CORPORATION6F NO 1 JINSHAN 8TH ST HSINCHU 300

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Lo-Tien Hsinchu, TW 2 1

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