Substrate processing apparatus, semiconductor device manufacturing method, substrate processing method, and recording medium
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United States of America Patent
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Jan 10, 2017
Grant Date -
Dec 18, 2014
app pub date -
Sep 3, 2014
filing date -
Mar 7, 2012
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Abstract
According to the present disclosure, it is possible to prevent particles from being generated and to improve substrate processing quality. A substrate processing apparatus includes cassette mounting unit on which process substrate cassette and dummy substrate cassette are mounted, the process substrate cassette being configured to accommodate a plurality of process substrates, and the dummy substrate cassette being configured to accommodate a plurality of dummy substrates, process chamber configured to process the process substrates and the dummy substrates, substrate support unit installed within the process chamber and provided with a plurality of substrate mounting portions where the process substrates and the dummy substrates are mounted, transfer unit configured to transfer the process substrates and the dummy substrates between the cassette mounting unit and the process chamber, and control unit configured to control substrate processing and to transfer processing of the process substrates and the dummy substrates.
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