High temperature high heating rate treatment of PDC cutters
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United States of America Patent
Stats
-
Jan 10, 2017
Grant Date -
Apr 21, 2016
app pub date -
Dec 22, 2015
filing date -
Apr 5, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A post manufacture method and apparatus for reducing residual stresses present within a component. The component includes a substrate, a polycrystalline structure coupled thereto, and residual stresses present therein. The method includes obtaining a component from a component category, determining a critical temperature and a critical time period for the component category at which the component becomes structurally impaired, determining a heat treatment temperature and a heat treatment time period based upon the critical temperature and the critical time period, and heating one or more remaining components from the component category to the heat treatment temperature for the heat treatment time period. The apparatus includes a heater defining a heating chamber and a molten bath positioned within the heating chamber. The components are placed within the pre-heated molten bath and isolated from oxygen during heating to the heat treatment temperature for the heat treatment time period.
First Claim
Other Claims data not available
Family
International Classification(s)
- C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
- C04B:LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREO....
- G01N:INVESTIGATING OR ANALYSING MATERIALS BY DETERMININ....
- B22F:WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES F....
- C21D:MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS....
- B24D:TOOLS FOR GRINDING, BUFFING, OR SHARPENING
- C22C:ALLOYS
- C25F:PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIAL....
- 2015 Application Filing Year
- C09K Class
- 2848 Applications Filed
- 2073 Patents Issued To-Date
- 72.79 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- C09K Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jul 10, 2028 |
