Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers
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United States of America Patent
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Jan 10, 2017
Grant Date -
Apr 23, 2009
app pub date -
Oct 1, 2008
filing date -
Oct 17, 2007
priority date (Note) -
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Abstract
Carriers suitable for receiving one or more semiconductor wafers for the machining thereof in lapping, grinding or polishing machines, comprise a core of a first material which has a high stiffness, the core being completely or partly coated with a second material, and also at least one cutout for receiving a semiconductor wafer, wherein the second material is a thermoset polyurethane elastomer having a Shore A hardness of 20-90. The carriers are preferably coated with the second material after chemical surface activation and application of adhesion promoter, and may be used for simultaneous double-side material-removing machining of a plurality of semiconductor wafers.
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