Ultrasonic excitation of segmented dies
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 10, 2017
Grant Date -
Jan 21, 2016
app pub date -
Jul 17, 2015
filing date -
Jul 17, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for reducing areas of friction within a forming die that includes identifying at least one region of interest in the forming die, wherein the at least one region of interest further includes a problematic aspect of a predetermined nature; designing a die segment corresponding to the at least one region of interest, wherein the die segment further includes at least one ultrasonic transducer embedded therein; modifying the forming die to receive the die segment; installing the die segment in the forming die and acoustically isolating the die segment from the remainder of the forming die; and energizing the ultrasonic transducer to provide ultrasonic energy to the die segment, wherein providing ultrasonic energy to the die segment addresses the problematic aspect of the at least one region of interest in the forming die.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully