Electronic device and method for manufacturing housing for same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 2017
Issued Date -
N/A
app pub date -
Jul 30, 2014
filing date -
Jul 30, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully