Flip chip bonder and flip chip bonding method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 3, 2017
Grant Date -
Dec 31, 2015
app pub date -
Sep 8, 2015
filing date -
Mar 12, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully