Photomask with three states for forming multiple layer patterns with a single exposure

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United States of America Patent

PATENT NO 9535316
SERIAL NO

14030755

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides one embodiment of a mask for a lithography exposure process. The mask includes a mask substrate; a first mask material layer patterned to have a first plurality of openings that define a first layer pattern; and a second mask material layer patterned to have a second plurality of openings that define a second layer pattern.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU 300-78

International Classification(s)

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  • 2013 Application Filing Year
  • H01L Class
  • 22267 Applications Filed
  • 20713 Patents Issued To-Date
  • 93.03 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2013201420152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jeng-Horng Hsin-Chu, TW 137 3250
Lu, Yen-Cheng New Taipei, TW 85 1437
Shih, Chih-Tsung Hsinchu, TW 146 2276
Yen, Anthony Hsinchu, TW 157 3414
Yu, Shinn-Sheng Hsinchu, TW 132 3917

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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