Reducing the influence of thermal expansion of connector pins on a substrate in a vacuum pump
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United States of America Patent
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Jan 3, 2017
Grant Date -
Jul 25, 2013
app pub date -
Jul 28, 2011
filing date -
Oct 19, 2010
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Abstract
A vacuum pump including a pump main unit and a control unit is disclosed. The control unit includes a substrate having electronic elements mounted thereon and terminal pins soldered to the substrate at a first end edge of the substrate. The substrate is mounted to a plate via an attachment near a second end edge opposing the first end edge and the plate is mounted to the pump main unit. The terminal pins extend through the plate. Upon linear thermal expansion of the terminal pins, by reason of the location of the terminal pins near the first end edge and the attachment near the second end edge, stresses in the soldered pin connections are reduced. A molding material having a Shore hardness of less than 50, is molded around the electronic elements on the substrate in one embodiment.
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