Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method
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United States of America Patent
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Dec 27, 2016
Grant Date -
Jun 27, 2013
app pub date -
Oct 24, 2012
filing date -
Dec 22, 2011
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Abstract
A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured.
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