Method of manufacturing printed wiring board, and printed wiring board
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United States of America Patent
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Dec 27, 2016
Issued Date -
N/A
app pub date -
Feb 23, 2011
filing date -
Feb 26, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
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