Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
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United States of America Patent
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Dec 27, 2016
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N/A
app pub date -
Jun 11, 2004
filing date -
Jun 20, 2003
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Abstract
A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.
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