Die bonder and bonding method
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United States of America Patent
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Dec 27, 2016
Grant Date -
Apr 7, 2016
app pub date -
Apr 29, 2015
filing date -
Apr 30, 2014
priority date (Note) -
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Abstract
A die bonder and a bonding method are provided that are capable of surely mounting a die on an intermediate stage and surely picking up the die from the intermediate stage and thus, are high in reliability. The die bonder is provided with the intermediate stage for mounting thereon the die picked up by the pickup head from a die supply unit. A mounting portion of the intermediate stage is provided with an uneven pattern including a plurality of mounting support protrusions having contact surfaces that flush contact the back surface of the die for supporting the die not to slip out of place, and a plurality of recesses formed between the mounting support protrusions.
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