Multi-layer substrate and method of manufacturing multi-layer substrate
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United States of America Patent
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Dec 20, 2016
Grant Date -
Nov 5, 2015
app pub date -
Apr 29, 2015
filing date -
Apr 30, 2014
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Abstract
The present invention relates to a multi-layer substrate which can be used in a wireless signal transmission/reception apparatus, etc, a through-hole and a first waveguide and a second waveguide which are formed by conductive films enclosing the inner surface of the through-hole are formed on an upper substrate and a lower substrate of the multi-layer substrate, respectively, and an RF signal can be transmitted between an upper surface and a lower surface through the two waveguides. A process of manufacturing a multi-layer substrate by a Surface Mount Technology (SMT) is used, so that a waveguide passing through the multi-layer substrate can be precisely and easily formed.
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