Mechanical measures to limit stress and strain in deformable electronics
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 13, 2016
Issued Date -
N/A
app pub date -
Dec 9, 2014
filing date -
Dec 9, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to limit bending, torsion, and stretching. A material layer is patterned onto the flexible circuit board with a specific pattern and place of deposition in order to modify the stress concentration and profile of the circuit board and increase its overall strength. The material layer may be configured to modify the stress concentrations during bending away from the weak points in the assembly or to spread the stress during bending by increasing the radius of the bend curvature and therefore decreasing the chance of mechanical failure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully